LM75AD,112【PDF 19/24 页】IC TEMP SENSOR DIGITAL 8-SOIC

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Sheet目录41

15页 16页 17页 18页 [19页]20页 21页 22页 23页

LM75A_4

Product data sheet

Rev. 04 10 July 2007

19 of 24

NXP Semiconductors

LM75A

Digital temperature sensor and thermal watchdog

14. Soldering

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 Surface mount reow

soldering description.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

" Through-hole components

" Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature prole. Leaded packages,

packages with solder balls, and leadless packages are all reow solderable.

Key characteristics in both wave and reow soldering are:

" Board specications, including the board nish, solder masks and vias

" Package footprints, including solder thieves and orientation

" The moisture sensitivity level of the packages

" Package placement

" Inspection and repair

" Lead-free soldering versus PbSn soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

" Process issues, such as application of adhesive and ux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

" Solder bath specications, including temperature and impurities

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LM75AD,118 功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC TS RoHS:否制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor

LM75AD.112 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Digital temperature sensor and thermal watchdog

LM75AD/G-T 功能描述:IC I2C TEMP SNSR/WATCHDOG 8-SOIC RoHS:是类别:集成电路 (IC) >> PMIC - 热管理系列:- 标准包装:1 系列:- 功能:温度监控系统（传感器）传感器类型:内部和外部感应温度:-40°C ~ 125°C，外部传感器精确度:±2.5°C 本地（最大值），±5°C 远程（最大值）拓扑:ADC，比较器，寄存器库输出类型:2 线 SMBus? 输出警报:无输出风扇:无电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6

LM75AD112 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:

LM75ADP 制造商:NXP Semiconductors 功能描述:Digital Temp Sensor 2-Wire,LM75ADP

LM75ADP,118 功能描述:板上安装温度传感器 TEMP SENSOR DIGITAL RoHS:否制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor

LM75ADP,118 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, 0.125C, 3C, TSSOP-8

LM75ADP,118-CUT TAPE 制造商:NXP 功能描述:LM75A Series SMD 5.5 mA Digital Temperature Sensor w/ Thermal Watchdog TSSOP-8

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